EP4CE6E22C8L vs EP4CE6E22C6 Vergleich
Detaillierter Direktvergleich von EP4CE6E22C8L von Intel und EP4CE6E22C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE6E22C8L | EP4CE6E22C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11,20 | $12,05 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 6,272 | — |
| Embedded Memory (Bits) | 276,480 | — |
| Embedded Memory Blocks (M9K) | 30 | — |
| Embedded 18x18 Multipliers | 15 | 15 |
| General-purpose PLLs | 2 | — |
| User I/O Count | 91 | — |
| User I/O Banks | 8 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 60 nm (low-power) | TSMC 60 nm low-k |
| Gehäuse | 144-LQFP Exposed Pad (EQFP-144), 0.5 mm pitch | — |
| Betriebstemperaturbereich | -40 C to +85 C (Industrial, 'L' suffix) | — |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Active Serial (EPCS) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Device Logic Elements | — | 6,272 LE |
| Logic Array Blocks (LABs) | — | 392 LABs |
| Total RAM Bits | — | 270 Kbit |
| PLLs | — | 2 |
| Maximum User I/Os | — | 91 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C6 |
| Betriebstemperatur | — | 0 °C to +85 °C (Commercial) |
| Package Type | — | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | — | 22 mm × 22 mm |
| Lead Pitch | — | 0.5 mm |
| Configuration Method | — | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |