EP4CE6E22C8L vs EP4CE6E22C6 Comparación
Comparación detallada lado a lado de EP4CE6E22C8L por Intel y EP4CE6E22C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE6E22C8L | EP4CE6E22C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $11,20 | $12,05 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 6,272 | — |
| Embedded Memory (Bits) | 276,480 | — |
| Embedded Memory Blocks (M9K) | 30 | — |
| Embedded 18x18 Multipliers | 15 | 15 |
| General-purpose PLLs | 2 | — |
| User I/O Count | 91 | — |
| User I/O Banks | 8 | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Process Technology | 60 nm (low-power) | TSMC 60 nm low-k |
| Encapsulado | 144-LQFP Exposed Pad (EQFP-144), 0.5 mm pitch | — |
| Rango de temperatura de funcionamiento | -40 C to +85 C (Industrial, 'L' suffix) | — |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Active Serial (EPCS) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-free / Halogen-free | Yes / Yes | — |
| Device Logic Elements | — | 6,272 LE |
| Logic Array Blocks (LABs) | — | 392 LABs |
| Total RAM Bits | — | 270 Kbit |
| PLLs | — | 2 |
| Maximum User I/Os | — | 91 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C6 |
| Temperatura de funcionamiento | — | 0 °C to +85 °C (Commercial) |
| Package Type | — | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | — | 22 mm × 22 mm |
| Lead Pitch | — | 0.5 mm |
| Configuration Method | — | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |