EP4CE6E22C9L vs EP4CE15E22C8N Vergleich
Detaillierter Direktvergleich von EP4CE6E22C9L von Intel und EP4CE15E22C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE6E22C9L | EP4CE15E22C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,75 | $15,95 |
| Series | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 6,272 | — |
| Logic Array Blocks (LAB) | [DATA_NEEDED: LAB count] | — |
| Total RAM Bits | 276,480 bits | — |
| Embedded Multipliers (18x18) | 15 | — |
| Maximum User I/O | 91 | — |
| User I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Gehäuse | 144-LQFP Exposed Pad (EQFP-144) | 144-pin EQFP (Enhanced QFP) with Exposed Pad |
| Package Dimensions | 22 x 22 mm | — |
| Lead Pitch | 0.5 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Process Node | 60 nm | — |
| Betriebstemperatur | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | C9 | 8 |
| RoHS-Status | Compliant | Compliant |
| Logic Elements (LEs) | — | 15,408 |
| Embedded Memory (Bits) | — | 516,096 |
| Embedded Memory (Kbits) | — | 504 |
| Embedded 18x18 Multipliers | — | 56 |
| General Purpose PLLs | — | 4 |
| User I/O Pins | — | 81 |
| Core Voltage | — | 1.2 V |
| MSL-Level | — | 3 |
| Process Technology | — | 60 nm low-power CMOS |
| Configuration Method | — | SRAM-based, AS / PS / JTAG |