EP4CE6E22C9L vs EP4CE15E22C8N Comparación
Comparación detallada lado a lado de EP4CE6E22C9L por Intel y EP4CE15E22C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE6E22C9L | EP4CE15E22C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,75 | $15,95 |
| Series | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 6,272 | — |
| Logic Array Blocks (LAB) | [DATA_NEEDED: LAB count] | — |
| Total RAM Bits | 276,480 bits | — |
| Embedded Multipliers (18x18) | 15 | — |
| Maximum User I/O | 91 | — |
| User I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Encapsulado | 144-LQFP Exposed Pad (EQFP-144) | 144-pin EQFP (Enhanced QFP) with Exposed Pad |
| Package Dimensions | 22 x 22 mm | — |
| Lead Pitch | 0.5 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Process Node | 60 nm | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | C9 | 8 |
| Estado RoHS | Compliant | Compliant |
| Logic Elements (LEs) | — | 15,408 |
| Embedded Memory (Bits) | — | 516,096 |
| Embedded Memory (Kbits) | — | 504 |
| Embedded 18x18 Multipliers | — | 56 |
| General Purpose PLLs | — | 4 |
| User I/O Pins | — | 81 |
| Core Voltage | — | 1.2 V |
| Nivel MSL | — | 3 |
| Process Technology | — | 60 nm low-power CMOS |
| Configuration Method | — | SRAM-based, AS / PS / JTAG |