EP4CE6E22C9L vs EP4CE6E22C7N Vergleich
Detaillierter Direktvergleich von EP4CE6E22C9L von Intel und EP4CE6E22C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE6E22C9L | EP4CE6E22C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,75 | $18,50 |
| Series | Cyclone IV E | — |
| Logic Elements (LE) | 6,272 | — |
| Logic Array Blocks (LAB) | [DATA_NEEDED: LAB count] | — |
| Total RAM Bits | 276,480 bits | 276,480 |
| Embedded Multipliers (18x18) | 15 | — |
| Maximum User I/O | 91 | — |
| User I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Gehäuse | 144-LQFP Exposed Pad (EQFP-144) | 144-EQFP (22x22 mm, 0.5 mm pitch) with exposed pad |
| Package Dimensions | 22 x 22 mm | — |
| Lead Pitch | 0.5 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Process Node | 60 nm | — |
| Betriebstemperatur | 0C to +85C (Commercial) | — |
| Speed Grade | C9 | 7 (commercial) |
| RoHS-Status | Compliant | Compliant |
| Family | — | Cyclone IV E |
| Logic Elements (LEs) | — | 6,272 |
| Number of LABs/CLBs | — | 392 |
| Number of I/O | — | 91 |
| Number of GPIO | — | 91 |
| Operating Supply Voltage (Core) | — | 1.2 V |
| Process Technology | — | 60 nm |
| Embedded Multipliers | — | Yes (18x18) |
| PLLs | — | Yes |
| Configuration Mode | — | JTAG / Active Serial |
| Lead Free | — | Yes |