EP4CE6E22C9L vs EP4CE6E22C7N Comparación
Comparación detallada lado a lado de EP4CE6E22C9L por Intel y EP4CE6E22C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE6E22C9L | EP4CE6E22C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,75 | $18,50 |
| Series | Cyclone IV E | — |
| Logic Elements (LE) | 6,272 | — |
| Logic Array Blocks (LAB) | [DATA_NEEDED: LAB count] | — |
| Total RAM Bits | 276,480 bits | 276,480 |
| Embedded Multipliers (18x18) | 15 | — |
| Maximum User I/O | 91 | — |
| User I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Encapsulado | 144-LQFP Exposed Pad (EQFP-144) | 144-EQFP (22x22 mm, 0.5 mm pitch) with exposed pad |
| Package Dimensions | 22 x 22 mm | — |
| Lead Pitch | 0.5 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Process Node | 60 nm | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | — |
| Speed Grade | C9 | 7 (commercial) |
| Estado RoHS | Compliant | Compliant |
| Family | — | Cyclone IV E |
| Logic Elements (LEs) | — | 6,272 |
| Number of LABs/CLBs | — | 392 |
| Number of I/O | — | 91 |
| Number of GPIO | — | 91 |
| Operating Supply Voltage (Core) | — | 1.2 V |
| Process Technology | — | 60 nm |
| Embedded Multipliers | — | Yes (18x18) |
| PLLs | — | Yes |
| Configuration Mode | — | JTAG / Active Serial |
| Lead Free | — | Yes |