EP4CE6E22C9L vs EP4CE6E22C9LN Vergleich
Detaillierter Direktvergleich von EP4CE6E22C9L von Intel und EP4CE6E22C9LN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE6E22C9L | EP4CE6E22C9LN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $8,75 | $18,95 |
| Series | Cyclone IV E | Cyclone® IV E |
| Logic Elements (LE) | 6,272 | 6,272 |
| Logic Array Blocks (LAB) | [DATA_NEEDED: LAB count] | — |
| Total RAM Bits | 276,480 bits | — |
| Embedded Multipliers (18x18) | 15 | — |
| Maximum User I/O | 91 | 91 |
| User I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Gehäuse | 144-LQFP Exposed Pad (EQFP-144) | 144-pin EQFP (EQFP-144, 22x22 mm, 0.5 mm pitch) |
| Package Dimensions | 22 x 22 mm | — |
| Lead Pitch | 0.5 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Process Node | 60 nm | — |
| Betriebstemperatur | 0C to +85C (Commercial) | [DATA_NEEDED: operating temperature grade] |
| Speed Grade | C9 | — |
| RoHS-Status | Compliant | Compliant (LEAD FREE per FindIC) |
| Device Family | — | EP4CE6 (Cyclone IV E) |
| Configurable Logic Blocks (CLB / LAB) | — | 392 |
| Embedded Memory (Total) | — | 276,480 bits |
| Distributed RAM | — | 270 Kbits |
| Block RAM (M9K) | — | 30 Kbits (M9K blocks) |
| Embedded 18x18 Multipliers | — | 15 |
| PLLs | — | 4 |
| Global Clocks | — | 20 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 60 nm |
| Package Style | — | Exposed Pad, GULL WING leads (HLFQFP) |