EP4CE6E22C9L vs EP4CE6E22C9LN Comparación
Comparación detallada lado a lado de EP4CE6E22C9L por Intel y EP4CE6E22C9LN por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CE6E22C9L | EP4CE6E22C9LN |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,75 | $18,95 |
| Series | Cyclone IV E | Cyclone® IV E |
| Logic Elements (LE) | 6,272 | 6,272 |
| Logic Array Blocks (LAB) | [DATA_NEEDED: LAB count] | — |
| Total RAM Bits | 276,480 bits | — |
| Embedded Multipliers (18x18) | 15 | — |
| Maximum User I/O | 91 | 91 |
| User I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Global Clock Networks | [DATA_NEEDED: global clock count] | — |
| Encapsulado | 144-LQFP Exposed Pad (EQFP-144) | 144-pin EQFP (EQFP-144, 22x22 mm, 0.5 mm pitch) |
| Package Dimensions | 22 x 22 mm | — |
| Lead Pitch | 0.5 mm | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Process Node | 60 nm | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | [DATA_NEEDED: operating temperature grade] |
| Speed Grade | C9 | — |
| Estado RoHS | Compliant | Compliant (LEAD FREE per FindIC) |
| Device Family | — | EP4CE6 (Cyclone IV E) |
| Configurable Logic Blocks (CLB / LAB) | — | 392 |
| Embedded Memory (Total) | — | 276,480 bits |
| Distributed RAM | — | 270 Kbits |
| Block RAM (M9K) | — | 30 Kbits (M9K blocks) |
| Embedded 18x18 Multipliers | — | 15 |
| PLLs | — | 4 |
| Global Clocks | — | 20 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 60 nm |
| Package Style | — | Exposed Pad, GULL WING leads (HLFQFP) |