EP4CE6E22I7N vs EP4CE6E22C6 Vergleich
Detaillierter Direktvergleich von EP4CE6E22I7N von Intel und EP4CE6E22C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE6E22I7N | EP4CE6E22C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11,85 | $12,05 |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LEs) | 6,272 | — |
| Configurable Logic Blocks (CLBs) | 392 | — |
| Embedded Memory (RAM) | 270 Kbits | — |
| User Flash Memory | 4 Kbits | — |
| User I/O Pins | 91 | — |
| PLLs (General-Purpose) | 2 | — |
| Global Clock Networks | Up to 20 | — |
| Process Technology | 60 nm (TSMC low-power) | TSMC 60 nm low-k |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V (nominal 1.2 V) | — |
| Operating Temperature (I7 grade) | -40C to +100C (junction) | — |
| Maximum Operating Frequency | Up to 472.5 MHz | — |
| Gehäuse | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad | — |
| Montageart | Surface Mount | Surface Mount |
| Configuration Method | Serial (EPCS) or JTAG | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| RoHS-Status | Compliant | Compliant |
| Device Logic Elements | — | 6,272 LE |
| Logic Array Blocks (LABs) | — | 392 LABs |
| Total RAM Bits | — | 270 Kbit |
| Embedded 18x18 Multipliers | — | 15 |
| PLLs | — | 2 |
| Maximum User I/Os | — | 91 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C6 |
| Betriebstemperatur | — | 0 °C to +85 °C (Commercial) |
| Package Type | — | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | — | 22 mm × 22 mm |
| Lead Pitch | — | 0.5 mm |