EP4CE6E22I7N vs EP4CE6E22C6 Comparison
Detailed side-by-side comparison of EP4CE6E22I7N by Intel and EP4CE6E22C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CE6E22I7N | EP4CE6E22C6 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LEs) | 6,272 | — |
| Configurable Logic Blocks (CLBs) | 392 | — |
| Embedded Memory (RAM) | 270 Kbits | — |
| User Flash Memory | 4 Kbits | — |
| User I/O Pins | 91 | — |
| PLLs (General-Purpose) | 2 | — |
| Global Clock Networks | Up to 20 | — |
| Process Technology | 60 nm (TSMC low-power) | TSMC 60 nm low-k |
| Core Voltage (VCCINT) | 1.0 V to 1.2 V (nominal 1.2 V) | — |
| Operating Temperature (I7 grade) | -40C to +100C (junction) | — |
| Maximum Operating Frequency | Up to 472.5 MHz | — |
| Package | 144-pin EQFP (Plastic Enhanced QFP) with exposed pad | — |
| Mounting Type | Surface Mount | Surface Mount |
| Configuration Method | Serial (EPCS) or JTAG | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |
| Supported I/O Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| MSL Level | 3 (per JEDEC J-STD-020) | — |
| RoHS Status | Compliant | Compliant |
| Device Logic Elements | — | 6,272 LE |
| Logic Array Blocks (LABs) | — | 392 LABs |
| Total RAM Bits | — | 270 Kbit |
| Embedded 18x18 Multipliers | — | 15 |
| PLLs | — | 2 |
| Maximum User I/Os | — | 91 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C6 |
| Operating Temperature | — | 0 °C to +85 °C (Commercial) |
| Package Type | — | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | — | 22 mm × 22 mm |
| Lead Pitch | — | 0.5 mm |