EP4CE75F29C8L vs EP4CE75F29I8L Vergleich
Detaillierter Direktvergleich von EP4CE75F29C8L von Intel und EP4CE75F29I8L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE75F29C8L | EP4CE75F29I8L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $109,80 | $203,73 |
| Family | Cyclone IV E | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Logic Elements (LE) | 75,408 | 75,408 |
| Configurable Logic Blocks (CLBs) | 4,713 | 4,713 |
| Embedded Memory | 2,810,880 bits (426 Kbits M9K blocks) | — |
| Embedded Multipliers (18x18) | 426 | — |
| General-Purpose I/O Pins | 426 (max) | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | 15 |
| Process Technology | 60 nm low-power CMOS | 60 nm low power CMOS |
| Core Voltage (VCCINT) | 1.2 V | — |
| Analog Voltage (VCCA) | 2.5 V | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Speed Grade | C8 (commercial, 8 speed bin) | 8 |
| Betriebstemperatur | 0C to 85C (commercial) | — |
| Gehäuse | FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch) | 780-ball FBGA (F29) 29x29 mm, 1.0 mm pitch |
| Ball Count | 780 | — |
| Montageart | Surface Mount | — |
| RoHS-Status | Compliant (lead-free) | Compliant |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Device Family | — | Cyclone IV E |
| Embedded Memory (bits) | — | 2,810,880 |
| Embedded 18x18 Multipliers | — | 274 |
| Maximum User I/O | — | 426 |
| General-Purpose PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Internal Operating Frequency (max) | — | 362 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C junction) |
| Configuration Memory | — | SRAM-based, requires external configuration device |