EP4CE75F29I8L vs EP4CE115F29C8N Vergleich
Detaillierter Direktvergleich von EP4CE75F29I8L von Intel und EP4CE115F29C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE75F29I8L | EP4CE115F29C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $203,73 | $38,90 |
| Device Family | Cyclone IV E | — |
| Logic Elements (LE) | 75,408 | — |
| Configurable Logic Blocks (CLBs) | 4,713 | — |
| Embedded Memory (bits) | 2,810,880 | — |
| Embedded 18x18 Multipliers | 274 | 66 |
| Maximum User I/O | 426 | — |
| General-Purpose PLLs | 4 | 4 |
| Global Clock Networks | 15 | — |
| Core Voltage | 1.2 V | — |
| Internal Operating Frequency (max) | 362 MHz | — |
| Process Technology | 60 nm low power CMOS | — |
| Gehäuse | 780-ball FBGA (F29) 29x29 mm, 1.0 mm pitch | 780-ball FBGA (FineLine BGA) |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Speed Grade | 8 | C8 |
| Configuration Memory | SRAM-based, requires external configuration device | — |
| RoHS-Status | Compliant | Compliant |
| Family | — | Cyclone IV E |
| Logic Elements | — | 114,480 |
| Total Memory Bits | — | 3,981,312 (3888 Kb) |
| User I/O Pins | — | 528 |
| I/O Banks | — | 8 |
| Process Node | — | 60 nm |
| Core Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| Betriebstemperatur | — | 0 °C to 85 °C (Commercial) |
| Montageart | — | Surface Mount |
| Configuration Method | — | JTAG, Passive/Active Serial, Fast Passive/Active Parallel |
| Radiation Hardened | — | No |
| Tray Quantity | — | 36 units |