EP4CE75F29I8L vs EP4CE75F29C8L Vergleich
Detaillierter Direktvergleich von EP4CE75F29I8L von Intel und EP4CE75F29C8L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CE75F29I8L | EP4CE75F29C8L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $203,73 | $109,80 |
| Device Family | Cyclone IV E | — |
| Logic Elements (LE) | 75,408 | 75,408 |
| Configurable Logic Blocks (CLBs) | 4,713 | 4,713 |
| Embedded Memory (bits) | 2,810,880 | — |
| Embedded 18x18 Multipliers | 274 | — |
| Maximum User I/O | 426 | — |
| General-Purpose PLLs | 4 | — |
| Global Clock Networks | 15 | 20 |
| Core Voltage | 1.2 V | — |
| Internal Operating Frequency (max) | 362 MHz | — |
| Process Technology | 60 nm low power CMOS | 60 nm low-power CMOS |
| Gehäuse | 780-ball FBGA (F29) 29x29 mm, 1.0 mm pitch | FBGA-780 (FineLine BGA, 29x29 mm, 1.0 mm pitch) |
| Operating Temperature Grade | Industrial (-40C to +100C junction) | — |
| Speed Grade | 8 | C8 (commercial, 8 speed bin) |
| Configuration Memory | SRAM-based, requires external configuration device | — |
| RoHS-Status | Compliant | Compliant (lead-free) |
| Family | — | Cyclone IV E |
| Device Type | — | FPGA (Field-Programmable Gate Array) |
| Embedded Memory | — | 2,810,880 bits (426 Kbits M9K blocks) |
| Embedded Multipliers (18x18) | — | 426 |
| General-Purpose I/O Pins | — | 426 (max) |
| PLLs | — | 4 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Analog Voltage (VCCA) | — | 2.5 V |
| I/O Bank Voltage (VCCIO) | — | 1.2 V to 3.3 V (bank-dependent) |
| Betriebstemperatur | — | 0C to 85C (commercial) |
| Ball Count | — | 780 |
| Montageart | — | Surface Mount |
| Configuration Scheme | — | AS, PS, JTAG, FPP |