EP4CGX110CF23C8N vs EP4CGX110CF23C7 Vergleich
Detaillierter Direktvergleich von EP4CGX110CF23C8N von Intel und EP4CGX110CF23C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110CF23C8N | EP4CGX110CF23C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $170,45 | $224,84 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | — |
| Logic Array Blocks (LABs) | 6,839 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| User I/O Count | 270 | — |
| Transceivers | 4 channels | 8 channels, up to 3.125 Gbps |
| Transceiver Data Rate (max) | 3.125 Gbps | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Process Node | 60 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | C8 | — |
| Betriebstemperatur | 0 C to 85 C (commercial) | Commercial (0C to +85C) - inferred from speed grade 'C' |
| Gehäuse | 484-ball FBGA (F23) | 484-ball FineLine BGA (F23) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| MSL-Level | 3 | — |
| Configuration Method | Quartus Prime / JTAG / Active Serial | — |
| Device Model | — | EP4CGX110 |
| Logic Elements (LEs) | — | 109,424 |
| Embedded Memory | — | 5,621,760 bits |
| User I/Os | — | 270 |
| Number of LABs | — | 6,839 |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 (general purpose) |
| Process Technology | — | 60 nm low-power |
| Configuration Methods | — | JTAG, AS, PS, FPP |