EP4CGX110CF23C8N vs EP4CGX110CF23C7 Comparación
Comparación detallada lado a lado de EP4CGX110CF23C8N por Intel y EP4CGX110CF23C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110CF23C8N | EP4CGX110CF23C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $170,45 | $224,84 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | — |
| Logic Array Blocks (LABs) | 6,839 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| User I/O Count | 270 | — |
| Transceivers | 4 channels | 8 channels, up to 3.125 Gbps |
| Transceiver Data Rate (max) | 3.125 Gbps | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Process Node | 60 nm | — |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | C8 | — |
| Temperatura de funcionamiento | 0 C to 85 C (commercial) | Commercial (0C to +85C) - inferred from speed grade 'C' |
| Encapsulado | 484-ball FBGA (F23) | 484-ball FineLine BGA (F23) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Nivel MSL | 3 | — |
| Configuration Method | Quartus Prime / JTAG / Active Serial | — |
| Device Model | — | EP4CGX110 |
| Logic Elements (LEs) | — | 109,424 |
| Embedded Memory | — | 5,621,760 bits |
| User I/Os | — | 270 |
| Number of LABs | — | 6,839 |
| Embedded 18x18 Multipliers | — | 56 |
| PLLs | — | 4 (general purpose) |
| Process Technology | — | 60 nm low-power |
| Configuration Methods | — | JTAG, AS, PS, FPP |