EP4CGX110CF23I7N vs EP4CGX75CF23I8N Vergleich
Detaillierter Direktvergleich von EP4CGX110CF23I7N von Intel und EP4CGX75CF23I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110CF23I7N | EP4CGX75CF23I8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.650,08 | $102,40 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Logic Elements | 109,424 | — |
| Configurable Logic Blocks (CLBs / LABs) | 6,839 | — |
| Embedded Memory | 5,621,760 bits | — |
| User I/O Count | 270 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Process Technology | 60 nm | 60 nm |
| Gehäuse | FBGA-484 (484-pin FineLine BGA) | 484-ball FBGA |
| Package Body Size | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Maximum Operating Frequency | 472.5 MHz | — |
| Speed Grade | I7 (industrial, balance of speed and power) | 8 (commercial fast) |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Betriebstemperatur | -40 °C to +100 °C (industrial, inferred from 'I') | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements (LE) | — | 73,920 |
| Embedded Memory Bits | — | 4,257,792 |
| Embedded Memory Type | — | M9K blocks |
| Embedded Multipliers (18x18) | — | 198 |
| Maximum User I/O Pins | — | 290 |
| Transceivers | — | 8 channels up to 3.125 Gbps |
| PCIe Hard IP | — | 1 hard PCIe Gen1 block (x1/x2/x4) |
| PLLs | — | 4 |
| DLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Package Code | — | F23 |
| Betriebs-Sperrschichttemperatur | — | -40C to +100C (industrial) |
| RoHS-Status | — | Compliant |
| MSL-Level | — | 3 |