EP4CGX110CF23I7N vs EP4CGX75CF23I8N Comparación
Comparación detallada lado a lado de EP4CGX110CF23I7N por Intel y EP4CGX75CF23I8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110CF23I7N | EP4CGX75CF23I8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.650,08 | $102,40 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Device Type | FPGA (Field Programmable Gate Array) | — |
| Logic Elements | 109,424 | — |
| Configurable Logic Blocks (CLBs / LABs) | 6,839 | — |
| Embedded Memory | 5,621,760 bits | — |
| User I/O Count | 270 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Process Technology | 60 nm | 60 nm |
| Encapsulado | FBGA-484 (484-pin FineLine BGA) | 484-ball FBGA |
| Package Body Size | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Maximum Operating Frequency | 472.5 MHz | — |
| Speed Grade | I7 (industrial, balance of speed and power) | 8 (commercial fast) |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Temperatura de funcionamiento | -40 °C to +100 °C (industrial, inferred from 'I') | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements (LE) | — | 73,920 |
| Embedded Memory Bits | — | 4,257,792 |
| Embedded Memory Type | — | M9K blocks |
| Embedded Multipliers (18x18) | — | 198 |
| Maximum User I/O Pins | — | 290 |
| Transceivers | — | 8 channels up to 3.125 Gbps |
| PCIe Hard IP | — | 1 hard PCIe Gen1 block (x1/x2/x4) |
| PLLs | — | 4 |
| DLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Package Code | — | F23 |
| Temperatura de unión de funcionamiento | — | -40C to +100C (industrial) |
| Estado RoHS | — | Compliant |
| Nivel MSL | — | 3 |