EP4CGX110DF23I7N vs EP4CE115F23I7N Vergleich
Detaillierter Direktvergleich von EP4CGX110DF23I7N von Intel und EP4CE115F23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF23I7N | EP4CE115F23I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $182,00 | $87,95 |
| Family | Cyclone IV GX | EP4CE115 (F23 package) |
| Logic Elements | 109,424 | — |
| Logic Array Blocks (LABs) | 6,839 | 7,180 |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | — |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power CMOS (TSMC) |
| Betriebstemperatur | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Speed Grade | 7 | — |
| Gehäuse | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | 484-FBGA (F23) 23x23 mm, 1.0 mm pitch |
| Package Code | BGA (FBGA) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Series | — | Cyclone IV E |
| Logic Elements (LE) | — | 114,480 |
| Embedded Memory Bits | — | 3,981,312 bits |
| Maximum User I/Os | — | 280 |
| Number of PLLs | — | 4 |
| 18x18 Hardware Multipliers | — | 266 |
| Core Voltage | — | 1.0 V / 1.2 V |
| I/O Voltage Banks | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration Method | — | JTAG, Active Serial, Active Parallel |
| MSL-Level | — | 3 |
| Lead-Free | — | Yes |