EP4CGX110DF23I7N vs EP4CE115F23I7N Comparación
Comparación detallada lado a lado de EP4CGX110DF23I7N por Intel y EP4CE115F23I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110DF23I7N | EP4CE115F23I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $182,00 | $87,95 |
| Family | Cyclone IV GX | EP4CE115 (F23 package) |
| Logic Elements | 109,424 | — |
| Logic Array Blocks (LABs) | 6,839 | 7,180 |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | — |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | — |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm low-power CMOS (TSMC) |
| Temperatura de funcionamiento | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Speed Grade | 7 | — |
| Encapsulado | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | 484-FBGA (F23) 23x23 mm, 1.0 mm pitch |
| Package Code | BGA (FBGA) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Series | — | Cyclone IV E |
| Logic Elements (LE) | — | 114,480 |
| Embedded Memory Bits | — | 3,981,312 bits |
| Maximum User I/Os | — | 280 |
| Number of PLLs | — | 4 |
| 18x18 Hardware Multipliers | — | 266 |
| Core Voltage | — | 1.0 V / 1.2 V |
| I/O Voltage Banks | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Configuration Method | — | JTAG, Active Serial, Active Parallel |
| Nivel MSL | — | 3 |
| Lead-Free | — | Yes |