EP4CGX110DF23I7N vs EP4CGX50DF23I8N Vergleich
Detaillierter Direktvergleich von EP4CGX110DF23I7N von Intel und EP4CGX50DF23I8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF23I7N | EP4CGX50DF23I8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $182,00 | $60,00 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 49,888 |
| Logic Array Blocks (LABs) | 6,839 | — |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | — |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | Up to 8 (3.125 Gbps) |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Betriebstemperatur | -40C to +100C (industrial) | -40C to +85C (Industrial) |
| Speed Grade | 7 | — |
| Gehäuse | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | 484-ball FineLine BGA (FBGA) |
| Package Code | BGA (FBGA) | F23 |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant (Pb-free) |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Core Voltage | — | 1.2 V |
| Temperature Grade | — | I8N (Industrial, Pb-free) |
| User I/O (max) | — | 364 |
| Embedded RAM | — | 234 Kbits (M9K blocks) |
| PLLs | — | 2 |
| PCIe Hard IP | — | Yes (Gen1/Gen2) |
| Multipliers | — | 18x18 dedicated DSP blocks |