EP4CGX110DF23I7N vs EP4CGX50DF23I8N Comparación
Comparación detallada lado a lado de EP4CGX110DF23I7N por Intel y EP4CGX50DF23I8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110DF23I7N | EP4CGX50DF23I8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $182,00 | $60,00 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 49,888 |
| Logic Array Blocks (LABs) | 6,839 | — |
| User I/O Pins | 270 | — |
| Embedded Memory | 4.4 Mbits (approximate) | — |
| Embedded 18x18 Multipliers | 56 | — |
| Transceivers | Up to 3.125 Gbps embedded transceivers | Up to 8 (3.125 Gbps) |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Temperatura de funcionamiento | -40C to +100C (industrial) | -40C to +85C (Industrial) |
| Speed Grade | 7 | — |
| Encapsulado | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch | 484-ball FineLine BGA (FBGA) |
| Package Code | BGA (FBGA) | F23 |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant (Pb-free) |
| Configuration Memory | SRAM-based (volatile, requires external config device) | — |
| Core Voltage | — | 1.2 V |
| Temperature Grade | — | I8N (Industrial, Pb-free) |
| User I/O (max) | — | 364 |
| Embedded RAM | — | 234 Kbits (M9K blocks) |
| PLLs | — | 2 |
| PCIe Hard IP | — | Yes (Gen1/Gen2) |
| Multipliers | — | 18x18 dedicated DSP blocks |