EP4CGX110DF31C7N vs EP4CGX110DF31I7 Vergleich
Detaillierter Direktvergleich von EP4CGX110DF31C7N von Intel und EP4CGX110DF31I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF31C7N | EP4CGX110DF31I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $112,40 | $276,34 |
| Family | Cyclone IV GX | — |
| Logic Elements | 109,424 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| Maximum User I/O | 475 | — |
| Process Technology | 60 nm | — |
| Core Voltage (VCCINT) | 1.2 V nominal (1.16 V to 1.24 V) | — |
| PLL Analog Voltage (VCCA) | 2.5 V nominal (2.375 V to 2.625 V) | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 8 (up to 3.125 Gbps) |
| Hard IP Block | PCIe Gen1 x1/x2/x4 | — |
| PLLs | 4 general-purpose | 4 |
| Gehäuse | 896-ball FBGA (F31) | 896-BGA (FBGA-896), 31 mm |
| Speed Grade | C7 (commercial) | -7 |
| Operating Temperature (Commercial) | 0 °C to 85 °C (TJ) | — |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Series | — | Cyclone IV GX |
| Device Logic Elements | — | 109,424 |
| Total Memory Bits | — | 5,621,760 |
| Number of Logic Array Blocks (LABs) | — | Not specified in provided data [DATA_NEEDED: LAB count] |
| Number of I/O | — | 475 user I/O |
| Multipliers (18x18) | — | 432 |
| M9K Memory Blocks | — | 270 |
| Ball Pitch | — | 0.8 mm |
| Temperature Grade | — | Industrial (-40C to +100C Tj) |
| Core Voltage | — | 1.2 V typical |
| Configuration Method | — | SRAM (EPCS or JTAG) |
| MSL-Level | — | 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days] |