EP4CGX110DF31C7N vs EP4CGX110DF31I7 Comparaison
Comparaison détaillée côte à côte de EP4CGX110DF31C7N par Intel et EP4CGX110DF31I7 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP4CGX110DF31C7N | EP4CGX110DF31I7 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $112,40 | $276,34 |
| Family | Cyclone IV GX | — |
| Logic Elements | 109,424 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| Maximum User I/O | 475 | — |
| Process Technology | 60 nm | — |
| Core Voltage (VCCINT) | 1.2 V nominal (1.16 V to 1.24 V) | — |
| PLL Analog Voltage (VCCA) | 2.5 V nominal (2.375 V to 2.625 V) | — |
| I/O Bank Voltage (VCCIO) | 1.2 V to 3.3 V (bank-dependent) | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 8 (up to 3.125 Gbps) |
| Hard IP Block | PCIe Gen1 x1/x2/x4 | — |
| PLLs | 4 general-purpose | 4 |
| Boîtier | 896-ball FBGA (F31) | 896-BGA (FBGA-896), 31 mm |
| Speed Grade | C7 (commercial) | -7 |
| Operating Temperature (Commercial) | 0 °C to 85 °C (TJ) | — |
| Type de montage | Surface Mount | Surface Mount |
| Statut RoHS | Compliant | Compliant |
| Series | — | Cyclone IV GX |
| Device Logic Elements | — | 109,424 |
| Total Memory Bits | — | 5,621,760 |
| Number of Logic Array Blocks (LABs) | — | Not specified in provided data [DATA_NEEDED: LAB count] |
| Number of I/O | — | 475 user I/O |
| Multipliers (18x18) | — | 432 |
| M9K Memory Blocks | — | 270 |
| Ball Pitch | — | 0.8 mm |
| Temperature Grade | — | Industrial (-40C to +100C Tj) |
| Core Voltage | — | 1.2 V typical |
| Configuration Method | — | SRAM (EPCS or JTAG) |
| Niveau MSL | — | 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days] |