EP4CGX110DF31C8N vs EP4CGX150DF27C8 Vergleich
Detaillierter Direktvergleich von EP4CGX110DF31C8N von Intel und EP4CGX150DF27C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF31C8N | EP4CGX150DF27C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $325,00 | $258,16 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 149,760 |
| Logic Array Blocks (LABs) | 6,839 | — |
| Embedded Memory Bits | 5,621,760 (approximately 702 Kbits) | — |
| Embedded Memory Blocks | M9K blocks, 9-bit parity | — |
| DSP Blocks (18x18 Multipliers) | 264 multipliers | — |
| Maximum User I/Os | 475 | — |
| I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | [DATA_NEEDED: PLL count] |
| Transceivers | 8 high-speed transceivers up to 3.125 Gbps | 8 x 3.125 Gbps |
| PCI Express Hard IP | PCIe Gen1/Gen2 x1/x2/x4 | — |
| Core Supply Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Gehäuse | 896-ball FineLine BGA (F31), 31 mm | 672-ball FBGA |
| Operating Temperature (Commercial) | 0C to 85C | — |
| Speed Grade | 8 | 8 |
| Configuration | SRAM-based, supports AS, PS, JTAG, FPP | — |
| RoHS-Status | Compliant | Compliant |
| Embedded Memory | — | 6,635,520 bits |
| User I/O | — | 393 |
| Core Voltage | — | 1.2 V |
| Embedded Multipliers | — | 720 (18x18) |
| Betriebstemperatur | — | 0C to 85C (commercial) |
| Configuration Modes | — | JTAG, Active Serial, Passive Serial |
| Montageart | — | Surface Mount (BGA) |