EP4CGX110DF31C8N vs EP4CGX150DF27C8 Comparación
Comparación detallada lado a lado de EP4CGX110DF31C8N por Intel y EP4CGX150DF27C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110DF31C8N | EP4CGX150DF27C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $325,00 | $258,16 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 149,760 |
| Logic Array Blocks (LABs) | 6,839 | — |
| Embedded Memory Bits | 5,621,760 (approximately 702 Kbits) | — |
| Embedded Memory Blocks | M9K blocks, 9-bit parity | — |
| DSP Blocks (18x18 Multipliers) | 264 multipliers | — |
| Maximum User I/Os | 475 | — |
| I/O Banks | 8 | — |
| PLLs | 4 general-purpose PLLs | [DATA_NEEDED: PLL count] |
| Transceivers | 8 high-speed transceivers up to 3.125 Gbps | 8 x 3.125 Gbps |
| PCI Express Hard IP | PCIe Gen1/Gen2 x1/x2/x4 | — |
| Core Supply Voltage | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Encapsulado | 896-ball FineLine BGA (F31), 31 mm | 672-ball FBGA |
| Operating Temperature (Commercial) | 0C to 85C | — |
| Speed Grade | 8 | 8 |
| Configuration | SRAM-based, supports AS, PS, JTAG, FPP | — |
| Estado RoHS | Compliant | Compliant |
| Embedded Memory | — | 6,635,520 bits |
| User I/O | — | 393 |
| Core Voltage | — | 1.2 V |
| Embedded Multipliers | — | 720 (18x18) |
| Temperatura de funcionamiento | — | 0C to 85C (commercial) |
| Configuration Modes | — | JTAG, Active Serial, Passive Serial |
| Tipo de montaje | — | Surface Mount (BGA) |