EP4CGX150CF23I7 vs EP4CGX150CF23I6N Vergleich
Detaillierter Direktvergleich von EP4CGX150CF23I7 von Intel und EP4CGX150CF23I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX150CF23I7 | EP4CGX150CF23I6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $192,00 | $175,80 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 149,760 | 149760 |
| Embedded Memory | 6,635,520 bits (6480 Kbits / 720 Kbits per M9K block) | 6635520 bits (6.6 Mbit) |
| DSP Blocks (18x18 Multipliers) | 360 | — |
| Maximum User I/O Pins | 270 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | — |
| PCIe Hard IP | 1 Gen1 x4 controller | — |
| PLLs | 4 user PLLs + 4 transceiver PLLs | 4 |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | I7 (industrial, fast) | 6 |
| Betriebstemperatur | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Gehäuse | 484-pin Fine-pitch BGA (FBGA-484, F23) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (per JEDEC J-STD-020) | — |
| User I/Os | — | 270 (per DigiKey listing) - 720 per family datasheet max |
| Anzahl der Pins | — | 484 |
| Package Type | — | FBGA (FineLine Ball Grid Array) |
| Core Voltage | — | 1.2 V |
| Transceiver Channels | — | 8 (up to 3.125 Gbps) |
| 18x18 Multipliers | — | Up to 360 |
| Memory Blocks | — | M9K (9 Kbit each) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Hard IP Blocks | — | PCIe Gen1 (x1/x2/x4), memory controller |