EP4CGX150CF23I7 vs EP4CGX150CF23I6N Comparación
Comparación detallada lado a lado de EP4CGX150CF23I7 por Intel y EP4CGX150CF23I6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX150CF23I7 | EP4CGX150CF23I6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $192,00 | $175,80 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 149,760 | 149760 |
| Embedded Memory | 6,635,520 bits (6480 Kbits / 720 Kbits per M9K block) | 6635520 bits (6.6 Mbit) |
| DSP Blocks (18x18 Multipliers) | 360 | — |
| Maximum User I/O Pins | 270 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | — |
| PCIe Hard IP | 1 Gen1 x4 controller | — |
| PLLs | 4 user PLLs + 4 transceiver PLLs | 4 |
| Process Technology | 60 nm low-power CMOS | 60 nm |
| Core Supply Voltage | 1.2 V | — |
| Speed Grade | I7 (industrial, fast) | 6 |
| Temperatura de funcionamiento | -40C to +100C (industrial) | -40C to +100C (Industrial) |
| Encapsulado | 484-pin Fine-pitch BGA (FBGA-484, F23) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-020) | — |
| User I/Os | — | 270 (per DigiKey listing) - 720 per family datasheet max |
| Número de pines | — | 484 |
| Package Type | — | FBGA (FineLine Ball Grid Array) |
| Core Voltage | — | 1.2 V |
| Transceiver Channels | — | 8 (up to 3.125 Gbps) |
| 18x18 Multipliers | — | Up to 360 |
| Memory Blocks | — | M9K (9 Kbit each) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Hard IP Blocks | — | PCIe Gen1 (x1/x2/x4), memory controller |