EP4CGX50CF23C7N vs EP4CGX50CF23I7 Vergleich
Detaillierter Direktvergleich von EP4CGX50CF23C7N von Intel und EP4CGX50CF23I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50CF23C7N | EP4CGX50CF23I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $110,50 | $112,00 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | — |
| Embedded Memory (Bits) | 2,562,048 (2.5 Mb) | — |
| User I/O | 290 | — |
| Logic Array Blocks | 47 | — |
| Multi-Gigabit Transceivers | 4 channels up to 3.125 Gbps | — |
| Hard Memory Controllers | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) | — |
| Core Voltage | 1.2 V | 1.2 V |
| I/O Voltage Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) | — |
| Gehäuse | 484-FBGA (F23, 23 x 23 mm) | 484-FBGA, F23, 23x23 mm, 1.0 mm pitch |
| Speed Grade | C7 (commercial) | — |
| Betriebstemperatur | -40C to +85C (commercial) | -40C to +100C (Industrial) |
| Process Technology | 60 nm TSMC low-power | 60 nm low-power |
| Configuration Modes | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel | — |
| RoHS-Status | Compliant (lead-free) | Compliant (lead-free) |
| Montageart | Surface Mount | — |
| Device Logic Elements | — | 49,888 |
| Logic Array Blocks (LABs) | — | 3,118 |
| Embedded Memory (bits) | — | 2,562,048 |
| Embedded Memory (M9K blocks) | — | 290 |
| 18x18 Multipliers | — | 220 |
| PLLs | — | 6 |
| Maximum User I/Os | — | 290 |
| Transceivers (GXB) | — | Up to 8 (3.125 Gbps) |
| Configuration Scheme | — | Active Serial, Passive Serial, JTAG |