EP4CGX50CF23C7N - Cyclone IV GX FPGA, 49K LE, 484-FBGA | Intel
Teilenummer: EP4CGX50CF23C7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $175.31 | $175,31 |
| 10 | $157.78 | $1.577,80 |
| 100 | $140.25 | $14.025,00 |
| 500 | $122.72 | $61.360,00 |
| 1.000 | $110.5 | $110.500,00 |
EP4CGX50CF23C7N Übersicht
A field-programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected via a programmable interconnect fabric, with embedded memory, DSP blocks, phase-locked loops (PLLs), and (in the Cyclone IV GX family) multi-gigabit transceivers (MGTs). The Cyclone IV family hierarchy sits below the high-end Stratix series and is targeted at cost- and power-sensitive volume production; within that family, the GX sub-family adds transceiver channels for PCIe Gen1, Gigabit Ethernet, and serial RapidIO. This positions the EP4CGX50CF23C7N as a 'transceiver-equipped Cyclone IV' rather than a plain logic FPGA.
Key features of this OPN include 4 transceiver channels capable of 3.125 Gbps operation, 8 input / 8 output PLLs (or the Cyclone IV GX equivalent count) for clock management, up to 2.5 Mb of user RAM, and a 1.2 V core supply with 2.5 V/3.3 V-tolerant I/O. The FBGA-484 package provides high pin density for the 290 user I/O count while keeping board routing manageable on standard 4-layer FR-4. The device supports configuration via JTAG, Active Serial, and Passive Parallel modes, and includes on-chip pull-up resistors for non-volatile configuration via Altera EPCS or EPCQ flash.
The Cyclone IV GX transceiver architecture is hardened for common serial protocols; up to 4 channels of PCIe Gen1 (x1/x2) hard IP, GMII/RGMII interfaces for GbE MACs, and basic serial RapidIO can be instantiated without external PHY silicon. For board designers, this means a single FPGA can implement a PCIe endpoint, a 1 Gbps Ethernet MAC, or a SRIO link with reduced BOM cost compared with using a general-purpose FPGA plus an external transceiver.
Typical applications include industrial machine vision frame grabbers (using the transceivers for Camera Link HS or CoaXPress), low-cost PCIe data-acquisition cards, broadcast video processing (SDI/HDMI bridging), wireless small-cell backhaul, and prototyping of ASIC functions before tape-out. The combination of low unit cost, low static power (~450 mW typical), and integrated transceivers makes the EP4CGX50CF23C7N a frequent choice when designers need more than a microcontroller but less than a Stratix-class device.
When designing with this FPGA, ensure that the transceiver reference clocks are sourced from a low-jitter oscillator (typical jitter under 1 ps RMS) and that the FPGA core decoupling uses 0.1 uF + 10 uF ceramic combinations per bank. The configuration scheme should be selected early because the FBGA package does not allow easy re-soldering of configuration-mode jumpers once PCB is assembled.
This page synthesizes distributor pricing, package-level drop-in alternatives from the same Cyclone IV GX family, and practical design notes that go beyond the manufacturer datasheet to help engineers source and apply the EP4CGX50CF23C7N.
Drop-in-Alternativen für EP4CGX50CF23C7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4CGX50CF23C7N (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Transceivers, RoHS Status, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4CGX50CF23C7
✅ Drop-In✓ Auf Lager
$55.1 / Stück
Datenblatt ansehen →EP4CGX50CF23C8N
✅ Drop-In✓ Auf Lager
$56.5 / Stück
Datenblatt ansehen →EP4CGX50CF23C6N
✅ Drop-In✓ Auf Lager
$65.8 / Stück
Datenblatt ansehen →EP4CGX50CF23I7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$121.4 / Stück
Datenblatt ansehen →EP4CGX30CF23C7N
✅ Drop-In✓ Auf Lager
$71.59 / Stück
Datenblatt ansehen →XC6SLX75-3FGG484
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP4CGX50CF23C7N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone IV GX |
| Logic Elements (LE) | 49,888 |
| Embedded Memory (Bits) | 2,562,048 (2.5 Mb) |
| User I/O | 290 |
| Logic Array Blocks | 47 |
| Multi-Gigabit Transceivers | 4 channels up to 3.125 Gbps |
| Hard Memory Controllers | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) |
| Core Voltage | 1.2 V |
| I/O Voltage Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) |
| Gehäuse | 484-FBGA (F23, 23 x 23 mm) |
| Speed Grade | C7 (commercial) |
| Betriebstemperatur | -40C to +85C (commercial) |
| Process Technology | 60 nm TSMC low-power |
| Configuration Modes | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel |
| RoHS-Status | Compliant (lead-free) |
| Montageart | Surface Mount |
EP4CGX50CF23C7N 484-fbga (f23, 23 x 23 mm) Pinbelegungsleitfaden
Pinbelegung für EP4CGX50CF23C7N (484-fbga (f23, 23 x 23 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4CGX50CF23C7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4CGX50CF23C7N ist geeignet für 6 Anwendungs: PCIe Gen1 Endpoint Card, Gigabit Ethernet MAC Bridge, Industrial Machine Vision Frame Grabber, Broadcast Video SDI/HDMI Bridging, Wireless Small-Cell Backhaul Modem, ASIC/SoC Prototyping Platform.
PCIe Gen1 Endpoint Card
The EP4CGX50CF23C7N is ideal for low-cost PCIe Gen1 endpoint designs because its 4 integrated multi-gigabit transceivers include hardened PCIe hard IP that supports x1 and x2 configurations without external PHY silicon. The 49,888 logic elements fit typical endpoint state machines plus a DMA engine, while the 2.5 Mb of embedded RAM serves as descriptor and data buffer memory. The 290 user I/O pins provide ample lanes for external local bus interfaces, DDR2 controller pins, and application-specific GPIO. Estimated: at PCIe Gen1 line rate of 2.5 GT/s per lane and x1 configuration, the device sustains roughly 200 MB/s of payload throughput, sufficient for data-acquisition, low-end graphics, and industrial I/O cards. Reference designs from Intel's Cyclone IV GX PCIe development kit demonstrate complete enumeration and DMA operation.
Empfohlen
Gigabit Ethernet MAC Bridge
The EP4CGX50CF23C7N's hardened GMII/RGMII MAC interface combined with 4 transceivers up to 3.125 Gbps makes it a compact GbE bridge between SFP modules and a host backplane. The transceiver channels support 1000BASE-X directly while the 49,888 LEs handle MAC framing, VLAN tagging, and a soft RGMII interface to an external PHY. With 2.5 Mb of embedded RAM, designers can implement multi-port packet buffers without external SRAM, reducing BOM cost. Estimated: at 1 Gbps line rate the device can sustain wire-speed forwarding for 64-byte frames on two simultaneous ports. Industrial networking applications benefit from the commercial -40C to +85C operating range.
Empfohlen
Industrial Machine Vision Frame Grabber
The EP4CGX50CF23C7N is well suited to industrial machine vision frame grabbers because its 4 transceivers can carry Camera Link HS, CoaXPress, or GigE Vision serial streams while 49,888 LEs process Bayer-to-RGB conversion, image enhancement, and trigger synchronization. The 2.5 Mb embedded memory doubles as line buffer and lookup-table storage for gamma and color correction, reducing external memory cost. The 290 user I/O pins support parallel sensor interfaces (LVDS-based sub-LVDS, SLVS) at the same time as the serial links. Estimated: at a typical 2 MPixel sensor running 60 fps, the FPGA handles real-time processing with under 20 percent logic utilization, leaving headroom for application-specific inspection algorithms.
Empfohlen
Broadcast Video SDI/HDMI Bridging
The EP4CGX50CF23C7N serves as a cost-effective SDI-to-HDMI or HDMI-to-SDI bridge in broadcast video equipment, leveraging its 4 transceivers for multi-rate SDI (HD-SDI, 3G-SDI up to 2.97 Gbps within the 3.125 Gbps transceiver envelope). The 49,888 LEs accommodate SDI scrambling/descrambling, CRC insertion/checking, and HDMI TMDS encoding logic, while 2.5 Mb embedded memory handles line buffering and ancillary data extraction. The 290 user I/O pins provide flexible audio and metadata GPIO plus external memory expansion. Estimated: a single EP4CGX50CF23C7N can implement one 3G-SDI input and one HDMI 1.4 output simultaneously while maintaining less than 60 percent logic utilization.
Empfohlen
Wireless Small-Cell Backhaul Modem
The EP4CGX50CF23C7N supports small-cell wireless backhaul modems using its 4 transceivers for CPRI (Common Public Radio Interface) up to 3.072 Gbps or OBSAI links to baseband modules. The 49,888 LEs handle packet segmentation, fronthaul compression, and timing/ synchronization protocols, while 2.5 Mb embedded memory serves as data-path buffer. The 290 user I/O support external Ethernet PHY interfaces and management GPIO. Estimated: at CPRI line rate 3 the device can sustain one antenna-carrier pair with under 50 percent logic utilization, sufficient for a single-sector small-cell deployment.
Empfohlen
ASIC/SoC Prototyping Platform
The EP4CGX50CF23C7N is frequently used for ASIC and SoC pre-silicon prototyping, where its 49,888 LEs emulate moderate-complexity logic, embedded memory, and DDR2 memory controller subsystems before tape-out. The 4 transceivers provide real-world I/O emulation for PCIe, GbE, and serial RapidIO interfaces that the final ASIC will use. The 290 user I/O pins map to a wide range of peripheral buses (SPI, I2C, UART, GPIO) for full-chip emulation. Estimated: a typical ASIC block of 30K-40K gates maps at 1.3x logic utilization on the FPGA due to LUT-vs-gate modeling, fitting comfortably within the 49,888 LE budget. Quartus II/Prime prototyping flows and Intel's SoC FPGA family migration paths accelerate bring-up.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4CGX50CF23C7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4CGX50CF23C7 | EP4CGX50CF23C8N | EP4CGX50CF23C6N | EP4CGX50CF23I7N | EP4CGX30CF23C7N | XC6SLX75-3FGG484 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Xilinx |
| Package | 484-FBGA (F23) | 484-FBGA (F23) | 484-FBGA (F23) | 484-FBGA (F23) | 484-FBGA (F23) | 484-FBGA (F23) | FBGA-484 |
| Logic Elements | 49,888 | 49,888 | 49,888 | 49,888 | 49,888 | 29,440 | 74,637 (Xilinx logic cells) |
| Speed Grade | C7 (commercial) | C7 (commercial) | C8 (commercial, faster) | C6 (commercial, slower) | I7 (industrial) | C7 (commercial) | -3 (Xilinx) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +100C | -40C to +85C | -40C to +85C |
| Transceiver Channels | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.125 Gbps | 4 x 3.2 Gbps GTP |
| Embedded Memory | 2.5 Mb | 2.5 Mb | 2.5 Mb | 2.5 Mb | 2.5 Mb | 1.3 Mb | 3.0 Mb (Block RAM) |
| User I/O | 290 | 290 | 290 | 290 | 290 | 290 | 280 |
Wichtigste Unterscheidungsmerkmale
- Hardened PCIe Gen1 and GbE MAC IP blocks (vs. EP4CGX30CF23C7N)
- Lower unit price than higher-density Cyclone IV GX members (vs. EP4CGX150CF23C7N)
- Xilinx Spartan-6 cross-vendor compatibility (vs. XC6SLX75-3FGG484)
Designhinweise
Estimated: at typical operating conditions (25 percent logic utilization, 4 transceivers active at 2.5 Gbps, 25 percent RAM utilization, 50 MHz core clock) the EP4CGX50CF23C7N draws approximately 1.5 W static plus 0.5 W dynamic, totaling roughly 2 W. Designers should budget a 3 W power supply with 4 A peak on the 1.2 V rail and ensure the regulator maintains within 30 mV of nominal to meet transceiver jitter requirements.
The 484-FBGA F23 package requires 1.0 mm ball pitch and a 23 x 23 mm land pattern. Use 0.5 oz outer copper and 1 oz inner copper on a 4-layer FR-4 stackup. Place 0.1 uF X7R decoupling capacitors within 5 mm of each power pin and add 10 uF bulk capacitors per power rail (1.2 V core, 2.5 V/3.3 V auxiliary, 1.5 V transceiver PLL) within 25 mm. Maintain 100 ohm differential impedance on transceiver pairs to avoid re-tuning of PCIe/GbE compliance boards.
Transceiver reference clocks must come from a low-jitter oscillator (typical less than 1 ps RMS jitter over 12 kHz to 20 MHz). Series-couple each clock with a 0.1 uF capacitor and route on an inner stripline layer. Transceiver differential pairs should be length-matched within 150 mil and routed with no more than two vias total to avoid reflections. According to Intel's Cyclone IV GX PCB design guidelines, transceiver TX/RX pairs require 90 ohm differential impedance.
Select the configuration mode early in the design: Active Serial (AS) via EPCS or EPCQ provides fastest configuration from a small flash, while Passive Parallel (PP) supports high-speed multi-FPGA configuration chains. The FBGA package does not allow reworking configuration-mode jumpers, so place MSEL pins in a strap resistor network accessible for debugging. JTAG chain should include a 4-wire header plus optional 10-pin Cortex-Debug-compatible connector for software debug tools.
Compliance-Informationen
RoHS and REACH compliant per 'N' suffix in OPN. JEDEC J-STD-020 MSL-3 floor life. AEC-Q100 not applicable for FPGAs of this density; choose industrial-temperature -I7N variants for automotive-grade applications requiring extended temperature operation.
