EP4CGX50CF23C7N vs EP4CGX50CF23I7N Vergleich
Detaillierter Direktvergleich von EP4CGX50CF23C7N von Intel und EP4CGX50CF23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50CF23C7N | EP4CGX50CF23I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $110,50 | $121,40 |
| Family | Cyclone IV GX | — |
| Logic Elements (LE) | 49,888 | 49,888 |
| Embedded Memory (Bits) | 2,562,048 (2.5 Mb) | — |
| User I/O | 290 | — |
| Logic Array Blocks | 47 | — |
| Multi-Gigabit Transceivers | 4 channels up to 3.125 Gbps | — |
| Hard Memory Controllers | Yes (DDR/DDR2/QDRII/QDRII+/RLDRAM II) | — |
| Core Voltage | 1.2 V | — |
| I/O Voltage Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL (1.2V-3.3V) | — |
| Gehäuse | 484-FBGA (F23, 23 x 23 mm) | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Speed Grade | C7 (commercial) | — |
| Betriebstemperatur | -40C to +85C (commercial) | -40C to +100C (industrial, I7) |
| Process Technology | 60 nm TSMC low-power | — |
| Configuration Modes | JTAG, Active Serial (EPCS), Passive Serial, Fast Passive Parallel | AS, PS, JTAG |
| RoHS-Status | Compliant (lead-free) | Compliant (lead-free N suffix) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Device Family | — | Cyclone IV GX |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Embedded Memory Bits | — | 2,562,048 |
| Maximum User I/O | — | 290 |
| Transceivers | — | 8 channels, up to 3.125 Gbps |
| Core Supply Voltage | — | 1.2 V |
| Design Toolchain | — | Quartus II / Quartus Prime |
| Process Node | — | 60 nm (Cyclone IV family) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |