EP4CGX50DF23C6N vs EP4CGX110DF23I7N Vergleich
Detaillierter Direktvergleich von EP4CGX50DF23C6N von Intel und EP4CGX110DF23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50DF23C6N | EP4CGX110DF23I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $52,30 | $182,00 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 109,424 |
| Configurable Logic Blocks (CLBs) | 3,118 | — |
| Embedded Memory | 2,340 Kbits | 4.4 Mbits (approximate) |
| Process Technology | 60 nm | 60 nm low-power CMOS |
| Core Voltage | 1.2 V | — |
| Number of Pins / Balls | 484 | — |
| Package Type | 484-ball FBGA (PBGA) | — |
| JEDEC Package Code | S-PBGA-B484 | — |
| User I/O | 218 | — |
| Transceiver Channels | Up to 8 | — |
| Maximum Transceiver Data Rate | 3.125 Gbps | — |
| Operating Temperature Grade | Commercial | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| Logic Array Blocks (LABs) | — | 6,839 |
| User I/O Pins | — | 270 |
| Embedded 18x18 Multipliers | — | 56 |
| Transceivers | — | Up to 3.125 Gbps embedded transceivers |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Betriebstemperatur | — | -40C to +100C (industrial) |
| Speed Grade | — | 7 |
| Gehäuse | — | 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch |
| Package Code | — | BGA (FBGA) |
| RoHS-Status | — | Compliant |
| Configuration Memory | — | SRAM-based (volatile, requires external config device) |