EP4CGX50DF23C6N vs EP4CGX110DF23I7N 对比

详细并排对比 EP4CGX50DF23C6N 出自 Intel 和 EP4CGX110DF23I7N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP4CGX50DF23C6N EP4CGX50DF23C6N - Cyclone IV GX FPGA 49,888 LE | Intel

EP4CGX50DF23C6N - Cyclone IV GX FPGA 49,888 LE | Intel

EP4CGX50DF23C6N ✓ 量产中

规格对比

参数 EP4CGX50DF23C6N EP4CGX110DF23I7N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $52.30 $182.00
Family Cyclone IV GX Cyclone IV GX
Logic Elements 49,888 109,424
Configurable Logic Blocks (CLBs) 3,118 —
Embedded Memory 2,340 Kbits 4.4 Mbits (approximate)
Process Technology 60 nm 60 nm low-power CMOS
Core Voltage 1.2 V —
Number of Pins / Balls 484 —
Package Type 484-ball FBGA (PBGA) —
JEDEC Package Code S-PBGA-B484 —
User I/O 218 —
Transceiver Channels Up to 8 —
Maximum Transceiver Data Rate 3.125 Gbps —
Operating Temperature Grade Commercial —
安装类型 Surface Mount (BGA) Surface Mount
Configuration Method JTAG / Passive Serial / Active Serial —
Logic Array Blocks (LABs) — 6,839
User I/O Pins — 270
Embedded 18x18 Multipliers — 56
Transceivers — Up to 3.125 Gbps embedded transceivers
Core Supply Voltage (VCCINT) — 1.15 V to 1.25 V (nominal 1.2 V)
工作温度 — -40C to +100C (industrial)
Speed Grade — 7
封装 — 484-ball FBGA, 23 x 23 mm, 1.00 mm pitch
Package Code — BGA (FBGA)
RoHS 状态 — Compliant
Configuration Memory — SRAM-based (volatile, requires external config device)

数据手册与资源

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