EP4CGX50DF23C7N vs EP4CGX50DF23I7N Vergleich
Detaillierter Direktvergleich von EP4CGX50DF23C7N von Intel und EP4CGX50DF23I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX50DF23C7N | EP4CGX50DF23I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $43,20 | $105,20 |
| Family | Cyclone IV GX | Cyclone IV |
| Logic Elements | 49,888 | — |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Total RAM Bits | 2,432 Kbit (≈ 304 KB) | — |
| Embedded 18x18 Multipliers | 66 | — |
| PLLs | 2 | — |
| Global Clock Networks | 8 (with up to 16 clock pins per region) | — |
| Number of I/O Pins | 290 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | — |
| Process Technology | 60 nm | 60 nm |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| Betriebstemperatur | 0 °C to 85 °C (commercial) | — |
| Gehäuse | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) | 484-ball FBGA (BGA-484) |
| Montageart | Surface Mount | Surface Mount |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Supported Memory Interfaces | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| RoHS-Status | Compliant (Pb-free variant) | Compliant |
| MSL-Level | 3 (168 hours) | — |
| Series | — | Cyclone IV GX |
| Logic Elements (LE) | — | 49,888 |
| Embedded Memory | — | 2,562 Kbit |
| Number of Logic Cells | — | 49,888 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Maximum User I/O Pins | — | 290 |
| Number of Transceivers | — | 8 (3.125 Gbps) |
| Package Body Size | — | 23 x 23 mm |
| Ball Pitch | — | 1.00 mm |
| Operating Temperature (Industrial) | — | -40 C to +100 C |
| Speed Grade | — | I7 |
| Number of PLLs | — | 4 |