EP4CGX75CF23C8 vs EP4CGX110CF23C8N Vergleich
Detaillierter Direktvergleich von EP4CGX75CF23C8 von Intel und EP4CGX110CF23C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX75CF23C8 | EP4CGX110CF23C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $88,20 | $170,45 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | — |
| Configurable Logic Blocks (CLBs) | 4,620 | — |
| Embedded Memory | 4,257,792 bits (~4.05 Mbit) | — |
| Maximum User I/O | 290 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 4 channels |
| PCIe Hard IP Blocks | 2 (Gen1) | — |
| Gehäuse | 484-ball FBGA (F23) | 484-ball FBGA (F23) |
| Package Body Size | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 60 nm low-power | — |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Speed Grade | 8 (commercial) | C8 |
| Betriebstemperatur | 0C to +85C (commercial) | 0 C to 85 C (commercial) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Logic Elements | — | 109,424 |
| Logic Array Blocks (LABs) | — | 6,839 |
| Embedded Memory (bits) | — | 5,621,760 |
| User I/O Count | — | 270 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Lead-Free | — | Yes |
| MSL-Level | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |