EP4CGX75CF23C8 vs EP4CGX110CF23C8N Comparación
Comparación detallada lado a lado de EP4CGX75CF23C8 por Intel y EP4CGX110CF23C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX75CF23C8 | EP4CGX110CF23C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $88,20 | $170,45 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | — |
| Configurable Logic Blocks (CLBs) | 4,620 | — |
| Embedded Memory | 4,257,792 bits (~4.05 Mbit) | — |
| Maximum User I/O | 290 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 4 channels |
| PCIe Hard IP Blocks | 2 (Gen1) | — |
| Encapsulado | 484-ball FBGA (F23) | 484-ball FBGA (F23) |
| Package Body Size | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 60 nm low-power | — |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Speed Grade | 8 (commercial) | C8 |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0 C to 85 C (commercial) |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Logic Elements | — | 109,424 |
| Logic Array Blocks (LABs) | — | 6,839 |
| Embedded Memory (bits) | — | 5,621,760 |
| User I/O Count | — | 270 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Lead-Free | — | Yes |
| Nivel MSL | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |