EP4CGX75CF23C8 vs EP4CGX110CF23C8N Comparison
Detailed side-by-side comparison of EP4CGX75CF23C8 by Intel and EP4CGX110CF23C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP4CGX75CF23C8 | EP4CGX110CF23C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 73,920 | — |
| Configurable Logic Blocks (CLBs) | 4,620 | — |
| Embedded Memory | 4,257,792 bits (~4.05 Mbit) | — |
| Maximum User I/O | 290 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | 4 channels |
| PCIe Hard IP Blocks | 2 (Gen1) | — |
| Package | 484-ball FBGA (F23) | 484-ball FBGA (F23) |
| Package Body Size | 23 x 23 mm | — |
| Ball Pitch | 1.0 mm | — |
| Process Technology | 60 nm low-power | — |
| Core Voltage | 1.2 V (typical) | 1.2 V |
| Speed Grade | 8 (commercial) | C8 |
| Operating Temperature | 0C to +85C (commercial) | 0 C to 85 C (commercial) |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS Status | Compliant | Compliant |
| Logic Elements | — | 109,424 |
| Logic Array Blocks (LABs) | — | 6,839 |
| Embedded Memory (bits) | — | 5,621,760 |
| User I/O Count | — | 270 |
| Transceiver Data Rate (max) | — | 3.125 Gbps |
| DSP Blocks (18x18 multipliers) | — | [DATA_NEEDED: DSP block count] |
| Process Node | — | 60 nm |
| Lead-Free | — | Yes |
| MSL Level | — | 3 |
| Configuration Method | — | Quartus Prime / JTAG / Active Serial |