EP4CGX75DF27C6 vs EP4CGX75DF27C8N Vergleich
Detaillierter Direktvergleich von EP4CGX75DF27C6 von Intel und EP4CGX75DF27C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX75DF27C6 | EP4CGX75DF27C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $109,20 | $117,11 |
| Family | Cyclone IV GX | — |
| Device Logic Elements | 73,920 | — |
| Embedded Memory Bits | 4,257,792 | — |
| Maximum User I/O | 310 | — |
| Process Technology | 60 nm CMOS | 60 nm low-power CMOS |
| Core Supply Voltage | 1.2 V | — |
| Gehäuse | 672-ball FBGA | 672-ball FBGA (F27) |
| Package Code | F27 (672-FBGA) | — |
| Transceivers | Integrated (3.125 Gbps) | — |
| Embedded Multipliers (18x18) | 274 | — |
| PLLs | Yes (periphery and global) | 4 |
| PCIe Hard IP | Yes (Gen1) | PCIe Gen1 x1/x2/x4 endpoint |
| Configuration Modes | JTAG, Active Serial, Passive Serial | — |
| Operating Temperature Grade | Commercial | — |
| Speed Grade | 6 | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount | Surface Mount |
| Device Family | — | Cyclone IV GX |
| Logic Elements (LE) | — | 73,920 |
| Logic Array Blocks (LAB) | — | 4,605 |
| Embedded Memory | — | 4,257,792 bits (approx. 532 Kbits RAM) |
| Embedded 18x18 Multipliers | — | 274 |
| User I/O Pins | — | 310 |
| High-Speed Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Configuration Method | — | SRAM-based, requires external config device |
| Lead-Free / Halogen-Free | — | Yes / [DATA_NEEDED: halogen free status] |