EP4CGX75DF27C6 vs EP4CGX75DF27C8N Comparación
Comparación detallada lado a lado de EP4CGX75DF27C6 por Intel y EP4CGX75DF27C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX75DF27C6 | EP4CGX75DF27C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $109,20 | $117,11 |
| Family | Cyclone IV GX | — |
| Device Logic Elements | 73,920 | — |
| Embedded Memory Bits | 4,257,792 | — |
| Maximum User I/O | 310 | — |
| Process Technology | 60 nm CMOS | 60 nm low-power CMOS |
| Core Supply Voltage | 1.2 V | — |
| Encapsulado | 672-ball FBGA | 672-ball FBGA (F27) |
| Package Code | F27 (672-FBGA) | — |
| Transceivers | Integrated (3.125 Gbps) | — |
| Embedded Multipliers (18x18) | 274 | — |
| PLLs | Yes (periphery and global) | 4 |
| PCIe Hard IP | Yes (Gen1) | PCIe Gen1 x1/x2/x4 endpoint |
| Configuration Modes | JTAG, Active Serial, Passive Serial | — |
| Operating Temperature Grade | Commercial | — |
| Speed Grade | 6 | — |
| Estado RoHS | Compliant | Compliant |
| Tipo de montaje | Surface Mount | Surface Mount |
| Device Family | — | Cyclone IV GX |
| Logic Elements (LE) | — | 73,920 |
| Logic Array Blocks (LAB) | — | 4,605 |
| Embedded Memory | — | 4,257,792 bits (approx. 532 Kbits RAM) |
| Embedded 18x18 Multipliers | — | 274 |
| User I/O Pins | — | 310 |
| High-Speed Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Configuration Method | — | SRAM-based, requires external config device |
| Lead-Free / Halogen-Free | — | Yes / [DATA_NEEDED: halogen free status] |