EP4CGX75DF27C6 vs EP4CGX75DF27C8N Comparaison
Comparaison détaillée côte à côte de EP4CGX75DF27C6 par Intel et EP4CGX75DF27C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP4CGX75DF27C6 | EP4CGX75DF27C8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $109,20 | $117,11 |
| Family | Cyclone IV GX | — |
| Device Logic Elements | 73,920 | — |
| Embedded Memory Bits | 4,257,792 | — |
| Maximum User I/O | 310 | — |
| Process Technology | 60 nm CMOS | 60 nm low-power CMOS |
| Core Supply Voltage | 1.2 V | — |
| Boîtier | 672-ball FBGA | 672-ball FBGA (F27) |
| Package Code | F27 (672-FBGA) | — |
| Transceivers | Integrated (3.125 Gbps) | — |
| Embedded Multipliers (18x18) | 274 | — |
| PLLs | Yes (periphery and global) | 4 |
| PCIe Hard IP | Yes (Gen1) | PCIe Gen1 x1/x2/x4 endpoint |
| Configuration Modes | JTAG, Active Serial, Passive Serial | — |
| Operating Temperature Grade | Commercial | — |
| Speed Grade | 6 | — |
| Statut RoHS | Compliant | Compliant |
| Type de montage | Surface Mount | Surface Mount |
| Device Family | — | Cyclone IV GX |
| Logic Elements (LE) | — | 73,920 |
| Logic Array Blocks (LAB) | — | 4,605 |
| Embedded Memory | — | 4,257,792 bits (approx. 532 Kbits RAM) |
| Embedded 18x18 Multipliers | — | 274 |
| User I/O Pins | — | 310 |
| High-Speed Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Configuration Method | — | SRAM-based, requires external config device |
| Lead-Free / Halogen-Free | — | Yes / [DATA_NEEDED: halogen free status] |