EP4CGX75DF27I6N vs EP4CGX75DF27C6N Vergleich
Detaillierter Direktvergleich von EP4CGX75DF27I6N von Intel und EP4CGX75DF27C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX75DF27I6N | EP4CGX75DF27C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $65,00 | $88,90 |
| Family | Cyclone IV GX | — |
| Device Model | EP4CGX75 | — |
| Logic Elements (LE) | 73,920 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 4,630 |
| Embedded Memory Bits | 4,257,792 | — |
| Embedded Memory Blocks | M9K (9 Kbit) | — |
| Maximum User I/O | 310 | 310 (FBGA-672) |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Hard PCIe Blocks | x1 / x2 Gen1 | — |
| Process Node | 60 nm | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Gehäuse | FBGA-672 (FineLine BGA) | 672-ball FineLine BGA (FBGA) |
| Pin / Ball Count | 672 | — |
| Operating Temperature (I6N suffix) | -40C to +100C (industrial) | — |
| Configuration Modes | JTAG, Serial, Parallel | — |
| RoHS-Status | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| Series | — | Cyclone IV GX |
| Logic Elements | — | 73,920 |
| Total Memory Bits | — | 4,257,792 |
| Embedded Multipliers (18x18) | — | 310 |
| Process Technology | — | 60 nm low power |
| Core Supply Voltage | — | 1.2 V |
| Number of Transceivers | — | 4 (up to 3.125 Gbps) |
| Speed Grade | — | C6 (slowest commercial) |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Montageart | — | Surface Mount (BGA) |
| MSL-Level | — | 3 |