EP4CGX75DF27I6N vs EP4CGX75DF27C6N Comparación
Comparación detallada lado a lado de EP4CGX75DF27I6N por Intel y EP4CGX75DF27C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX75DF27I6N | EP4CGX75DF27C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $65,00 | $88,90 |
| Family | Cyclone IV GX | — |
| Device Model | EP4CGX75 | — |
| Logic Elements (LE) | 73,920 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | 4,630 |
| Embedded Memory Bits | 4,257,792 | — |
| Embedded Memory Blocks | M9K (9 Kbit) | — |
| Maximum User I/O | 310 | 310 (FBGA-672) |
| Transceivers | Up to 8 channels | — |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| PLLs | [DATA_NEEDED: total PLL count] | — |
| Hard PCIe Blocks | x1 / x2 Gen1 | — |
| Process Node | 60 nm | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| Encapsulado | FBGA-672 (FineLine BGA) | 672-ball FineLine BGA (FBGA) |
| Pin / Ball Count | 672 | — |
| Operating Temperature (I6N suffix) | -40C to +100C (industrial) | — |
| Configuration Modes | JTAG, Serial, Parallel | — |
| Estado RoHS | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| Series | — | Cyclone IV GX |
| Logic Elements | — | 73,920 |
| Total Memory Bits | — | 4,257,792 |
| Embedded Multipliers (18x18) | — | 310 |
| Process Technology | — | 60 nm low power |
| Core Supply Voltage | — | 1.2 V |
| Number of Transceivers | — | 4 (up to 3.125 Gbps) |
| Speed Grade | — | C6 (slowest commercial) |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Tipo de montaje | — | Surface Mount (BGA) |
| Nivel MSL | — | 3 |