EP4CGX75DF27I6N vs EP4CGX75DF27C8N Vergleich

Detaillierter Direktvergleich von EP4CGX75DF27I6N von Intel und EP4CGX75DF27C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4CGX75DF27I6N EP4CGX75DF27C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $65,00 $117,11
Family Cyclone IV GX —
Device Model EP4CGX75 —
Logic Elements (LE) 73,920 73,920
Logic Array Blocks (LABs) [DATA_NEEDED: LAB count] —
Embedded Memory Bits 4,257,792 —
Embedded Memory Blocks M9K (9 Kbit) —
Maximum User I/O 310 —
Transceivers Up to 8 channels —
Transceiver Data Rate Up to 3.125 Gbps —
PLLs [DATA_NEEDED: total PLL count] 4
Hard PCIe Blocks x1 / x2 Gen1 —
Process Node 60 nm —
Core Voltage (VCCINT) 1.2 V —
Gehäuse FBGA-672 (FineLine BGA) 672-ball FBGA (F27)
Pin / Ball Count 672 —
Operating Temperature (I6N suffix) -40C to +100C (industrial) —
Configuration Modes JTAG, Serial, Parallel —
RoHS-Status Compliant Compliant
Lead-Free Yes —
Device Family — Cyclone IV GX
Logic Array Blocks (LAB) — 4,605
Embedded Memory — 4,257,792 bits (approx. 532 Kbits RAM)
Embedded 18x18 Multipliers — 274
User I/O Pins — 310
High-Speed Transceivers — Up to 8 channels, 3.125 Gbps
Global Clock Networks — 20
Core Voltage — 1.2 V
Process Technology — 60 nm low-power CMOS
Operating Temperature (Commercial) — 0C to +85C
Montageart — Surface Mount
Configuration Method — SRAM-based, requires external config device
PCIe Hard IP — PCIe Gen1 x1/x2/x4 endpoint
Lead-Free / Halogen-Free — Yes / [DATA_NEEDED: halogen free status]

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