EP4CGX75DF27I6N vs EP4CGX75DF27C8N Comparação

Comparação detalhada lado a lado de EP4CGX75DF27I6N por Intel e EP4CGX75DF27C8N por Intel. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Comparação de especificações

Parâmetro EP4CGX75DF27I6N EP4CGX75DF27C8N
Marca Intel Intel
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $65,00 $117,11
Family Cyclone IV GX —
Device Model EP4CGX75 —
Logic Elements (LE) 73,920 73,920
Logic Array Blocks (LABs) [DATA_NEEDED: LAB count] —
Embedded Memory Bits 4,257,792 —
Embedded Memory Blocks M9K (9 Kbit) —
Maximum User I/O 310 —
Transceivers Up to 8 channels —
Transceiver Data Rate Up to 3.125 Gbps —
PLLs [DATA_NEEDED: total PLL count] 4
Hard PCIe Blocks x1 / x2 Gen1 —
Process Node 60 nm —
Core Voltage (VCCINT) 1.2 V —
Encapsulamento FBGA-672 (FineLine BGA) 672-ball FBGA (F27)
Pin / Ball Count 672 —
Operating Temperature (I6N suffix) -40C to +100C (industrial) —
Configuration Modes JTAG, Serial, Parallel —
Status RoHS Compliant Compliant
Lead-Free Yes —
Device Family — Cyclone IV GX
Logic Array Blocks (LAB) — 4,605
Embedded Memory — 4,257,792 bits (approx. 532 Kbits RAM)
Embedded 18x18 Multipliers — 274
User I/O Pins — 310
High-Speed Transceivers — Up to 8 channels, 3.125 Gbps
Global Clock Networks — 20
Core Voltage — 1.2 V
Process Technology — 60 nm low-power CMOS
Operating Temperature (Commercial) — 0C to +85C
Tipo de montagem — Surface Mount
Configuration Method — SRAM-based, requires external config device
PCIe Hard IP — PCIe Gen1 x1/x2/x4 endpoint
Lead-Free / Halogen-Free — Yes / [DATA_NEEDED: halogen free status]

Fichas técnicas e recursos

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