EP4CGX75DF27I8N vs EP4CGX75DF27C8N Vergleich

Detaillierter Direktvergleich von EP4CGX75DF27I8N von Intel und EP4CGX75DF27C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP4CGX75DF27I8N EP4CGX75DF27C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $89,95 $117,11
Family Cyclone IV GX —
Logic Elements 73,920 —
Total Memory Bits 4,257,792 —
Embedded Memory 310 Kbits (M9K blocks) + 414 Kbits (M144K blocks) per datasheet, see [DATA_NEEDED: exact total] 4,257,792 bits (approx. 532 Kbits RAM)
User I/O Pins 310 310
Transceiver Channels 8 —
Max Transceiver Data Rate 3.125 Gbps —
Process Technology 60 nm low-power CMOS 60 nm low-power CMOS
Core Voltage 1.2 V 1.2 V
Gehäuse 672-ball FBGA (F27) 672-ball FBGA (F27)
Betriebstemperatur -40C to +100C (Industrial, I-suffix) —
Multipliers (18x18) [DATA_NEEDED: 18x18 multiplier count] —
PLLs [DATA_NEEDED: PLL count] 4
Hard IP PCIe Gen1, memory controller —
Configuration Interface JTAG, serial, passive parallel —
RoHS-Status [DATA_NEEDED: confirm from datasheet] Compliant
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
Device Family — Cyclone IV GX
Logic Elements (LE) — 73,920
Logic Array Blocks (LAB) — 4,605
Embedded 18x18 Multipliers — 274
High-Speed Transceivers — Up to 8 channels, 3.125 Gbps
Global Clock Networks — 20
Operating Temperature (Commercial) — 0C to +85C
Montageart — Surface Mount
Configuration Method — SRAM-based, requires external config device
PCIe Hard IP — PCIe Gen1 x1/x2/x4 endpoint
Lead-Free / Halogen-Free — Yes / [DATA_NEEDED: halogen free status]

Datenblätter & Ressourcen

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