EP4SGX110DF29I3G vs EP4SGX110DF29C3G Vergleich
Detaillierter Direktvergleich von EP4SGX110DF29I3G von Intel und EP4SGX110DF29C3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX110DF29I3G | EP4SGX110DF29C3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.995,00 | $2.610,50 |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV | Stratix IV GX |
| Process Technology | 40 nm | 40 nm |
| Logic Elements (LE) | 105,600 | — |
| Adaptive Logic Modules (ALM) | 41,250 | — |
| Embedded Memory Bits | 9,793,536 | — |
| Embedded Memory Blocks (M9K) | 660 | — |
| DSP Blocks | 660 (18x18 multipliers) | 266 (18x18 multipliers) |
| Maximum User I/O | 372 | — |
| Transceivers | 16 (up to 8.5 Gbps) | — |
| PCIe Hard IP | Gen2 x4 (8.5 Gbps) | — |
| Gehäuse | 780-ball FCBGA, 29x29 mm | — |
| Package Code | DF29 | — |
| Betriebstemperatur | -40C to +100C (Industrial I3 grade) | Commercial (0C to +85C) - per C3 grade suffix |
| Speed Grade | 3 | — |
| Montageart | Surface Mount | Surface Mount (Flip-Chip BGA) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements | — | 105,600 |
| Adaptive Logic Modules (ALMs) | — | 4,224 LABs |
| Total Memory Bits | — | 9,793,536 |
| User I/O Count | — | 372 |
| Package Type | — | 780-BBGA, FCBGA (Flip-Chip) |
| Package Pin/Ball Count | — | 780 |
| Versorgungsspannung | — | 0.9 V core |
| Transceiver Data Rate | — | Up to 8.5 Gbps |
| Transceiver Count | — | [DATA_NEEDED: number of transceivers] |