EP4SGX360FF35C2XN vs EP4SGX360FF35C3 Vergleich
Detaillierter Direktvergleich von EP4SGX360FF35C2XN von Intel und EP4SGX360FF35C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FF35C2XN | EP4SGX360FF35C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.600,00 | $2.285,00 |
| Family | Stratix IV GX | Stratix IV GX FPGA |
| Logic Elements | 353,600 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | — |
| Number of I/O | 564 | — |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | — |
| Number of Transceivers | 24 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Gehäuse | 1152-BBGA, FCBGA (Flip-Chip BGA) | 1152-FBGA (35x35 mm), FCBGA |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0C to +85C (Commercial) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Series | — | Stratix IV GX |
| Logic Elements (LE) | — | 353,600 |
| Logic Array Blocks (LAB) | — | 14,144 |
| Embedded Memory | — | 23,105,536 bits |
| User I/O Pins | — | 564 |
| Core Voltage | — | 0.9 V (0.87 V to 0.93 V) |
| Betriebs-Sperrschichttemperatur | — | 0 C to 85 C |
| Grade | — | Commercial |
| Speed/Package Grade | — | FF35 |
| Speichertyp | — | TriMatrix (MLAB + M9K + M144K blocks) |
| DSP Blocks | — | Yes (dedicated) |
| Hard Memory Controller | — | DDR/DDR2/DDR3, QDRII+, RLDRAM II |