EP4SGX360FF35C2XN vs EP4SGX360FF35C3 对比
详细并排对比 EP4SGX360FF35C2XN 出自 Intel 和 EP4SGX360FF35C3 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | EP4SGX360FF35C2XN | EP4SGX360FF35C3 |
|---|---|---|
| 品牌 | Intel | Intel |
| 分类 | FPGA & CPLD | FPGA & CPLD |
| 生命周期状态 | 有效 | 不推荐新设计 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $2,600.00 | $2,285.00 |
| Family | Stratix IV GX | Stratix IV GX FPGA |
| Logic Elements | 353,600 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | — |
| Number of I/O | 564 | — |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | — |
| Number of Transceivers | 24 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| 封装 | 1152-BBGA, FCBGA (Flip-Chip BGA) | 1152-FBGA (35x35 mm), FCBGA |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | 0C to +85C (Commercial) | — |
| RoHS 状态 | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Series | — | Stratix IV GX |
| Logic Elements (LE) | — | 353,600 |
| Logic Array Blocks (LAB) | — | 14,144 |
| Embedded Memory | — | 23,105,536 bits |
| User I/O Pins | — | 564 |
| Core Voltage | — | 0.9 V (0.87 V to 0.93 V) |
| 工作结温 | — | 0 C to 85 C |
| Grade | — | Commercial |
| Speed/Package Grade | — | FF35 |
| 存储器类型 | — | TriMatrix (MLAB + M9K + M144K blocks) |
| DSP Blocks | — | Yes (dedicated) |
| Hard Memory Controller | — | DDR/DDR2/DDR3, QDRII+, RLDRAM II |