EP4SGX360FF35C2XN vs EP4SGX360FF35I3N Vergleich
Detaillierter Direktvergleich von EP4SGX360FF35C2XN von Intel und EP4SGX360FF35I3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FF35C2XN | EP4SGX360FF35I3N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.600,00 | $9.100,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | — |
| Number of I/O | 564 | — |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | — |
| Number of Transceivers | 24 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | — |
| Gehäuse | 1152-BBGA, FCBGA (Flip-Chip BGA) | 1152-BBGA, FCBGA (35 mm body, 1 mm pitch) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0C to +85C (Commercial) | -40 °C to +100 °C (Industrial) |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | Stratix IV GX |
| Logic Elements (LE) | — | 353,600 |
| Adaptive Logic Modules (ALM) | — | 141,440 |
| Embedded Memory (Bits) | — | 23,105,536 |
| Total RAM Blocks | — | 564 (M20K blocks) |
| User I/O Count | — | 564 |
| Number of LABs/CLBs | — | 14144 |
| Supply Voltage Core | — | 0.95 V (typical) |
| Transceiver Data Rate | — | Up to 8.5 Gbps |
| Process Node | — | 40 nm |