EP4SGX360FF35C2XN vs EP4SGX360FH29C2XN Vergleich
Detaillierter Direktvergleich von EP4SGX360FF35C2XN von Intel und EP4SGX360FH29C2XN von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FF35C2XN | EP4SGX360FH29C2XN |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2.600,00 | $2.210,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353,600 | 353,600 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| LABs/CLBs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | 23,105,536 |
| Number of Logic Elements/Cells | 353,600 | — |
| Total RAM Bits | 23,105,536 | — |
| Number of I/O | 564 | — |
| User I/O Banks | 12 | — |
| Supply Voltage - Core | 0.9 V | — |
| Speed Grade | -2 | C2 |
| Number of Transceivers | 24 | — |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| DSP Multipliers (18x18) | 1,920 (estimated per family datasheet) | — |
| Process Technology | 40 nm TSMC | 40 nm |
| Gehäuse | 1152-BBGA, FCBGA (Flip-Chip BGA) | — |
| Montageart | Surface Mount | — |
| Betriebstemperatur | 0C to +85C (Commercial) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | EP4SGX |
| Logic Array Blocks (LABs) | — | 14,144 |
| Maximum User I/Os | — | 289 |
| Number of Terminals | — | 780 |
| Package Type | — | 780-ball FCBGA (H-BGA) |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Commercial C2 (0C to +85C) |
| Lead-Free (X suffix) | — | Yes |
| Configuration | — | Field Programmable Gate Array |