EP4SGX360FF35C4 vs EP4SGX360FF35I3 Vergleich
Detaillierter Direktvergleich von EP4SGX360FF35C4 von Intel und EP4SGX360FF35I3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4SGX360FF35C4 | EP4SGX360FF35I3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5.189,41 | $1.695,00 |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements | 353600 | — |
| Number of LABs/CLBs | 14144 | — |
| Total RAM Bits | 23105536 | 23,105,536 |
| Number of I/O | 564 | — |
| Number of Transceivers | 8 | [DATA_NEEDED: transceiver count] |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Gehäuse | 1152-BBGA, FCBGA (flip-chip) | 1152-BBGA, FCBGA (Flip-Chip) |
| Betriebstemperatur | 0C to +85C (commercial) | -40C to +100C |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 3 (per JEDEC J-STD-020) | [DATA_NEEDED: MSL] |
| RoHS-Status | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes (per BGA finish) | — |
| Supplier Device Package | 1152-FBGA | — |
| Series | — | Stratix IV GX |
| Logic Elements (LE) | — | 353,600 |
| LABs/CLBs | — | 14,144 |
| Embedded Memory | — | [DATA_NEEDED: total Kbits] |
| User I/O Count | — | 564 |
| Number of I/O Banks | — | [DATA_NEEDED: I/O bank count] |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: Gbps] |
| Number of PLLs | — | [DATA_NEEDED: PLL count] |
| Speed Grade | — | I3 |